HiSilicon joins growing list of TD-LTE modem chip suppliers at Mobile World Congress

At Mobile World Congress (MWC) in Barcelona this week, HiSilicon joined a growing list of companies that are laying claim to being first to offer a multi-mode Time Division Duplexing / Frequency Division Duplexing (TDD/FDD) modem chip for LTE applications. Marvell Technologies also spotlighted their TDD-LTE platforms at MWC, including the the PXA1202 which they first announced at PT/EXPO Comm last year. Qualcomm also announced dual-mode capability, with their 28nm MDM9625 and MDM9225. The MDM9225 also supports HSPA+ Release 9, and TD-SCDMA, while the MDM9625 adds EV-DO Revision B, and EV-DO Advanced to the 9225's capabilities.

The few specifications announced by HiSilicon for the Balong 710 are similar to competitor Marvell:

• Category-4 LTE FDD mode: 150Mbit/s downlink and 50Mbit/s uplink.
• TD-LTE mode: up to 112Mbit/s downlink and up to 30Mbit/s uplink.
• WCDMA Dual Carrier with MIMO: 84Mbit/s downlink and 23Mbit/s uplink.
• Dual-Layer Beam Forming technology. 

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